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Semiconductor packaging

Our materials used in semiconductor assembly and packaging.We offer a solid at the bottom of the crystal glue, plastic packaging, filling and thermal interface materials.They help improve performance, reduce the external environment impact and mechanical stress, improve reliability and service life, and reduce the shape restriction, thus reducing the cost.

Level of semiconductor product of thermal conductivity

ourCoolThermThermal management materials is very important to the reliability of the semiconductor chip.TIM, such as adhesives, caulking material, gel or grease, can effectively the transmission of heat from a semiconductor chip to the radiator.These different material performance, can choose suitable products according to the final application.

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Solid crystal material

Solid crystal plastic cement the wafer or components directly lead frame or other base material.The product series provide many solutions to meet your demand for mechanical strength, electrical conductivity and heat dissipation.Common use solid crystal gel encapsulation are:DIP,SOIC,QFP,COBAnd so on.And by dispensing, or printingThe PinThe needle transfer achieve kinds of applications.

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Semiconductor encapsulation adhesive

Rubber is mainly used for packaging state line or component internal need to enhance reliability.ourSemiconductor encapsulation adhesive具有高纯度，用于包封、围堰及填充或者其他板级模块封装。

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At the bottom of the filling

We fill the adhesive is of high purity semiconductor level at the bottom of epoxy resin, can be used for flip chip components, chip scale packages(CSP)And the ball grid array(BGA)Components at the bottom of the fill.Designed for small gaps and ball spacing application configuration, can strengthen resistance drop and temperature shock.affordable260 ° c.Lead-free reflow soldering process.

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gel

Gel is a kind of has a certain stick relay the thermal interface materials and repair.ourgel相对于其他导热界面材料具有不易油析、分离和开裂的特性。能在倒装芯片微处理器、塑封引脚级阵列(PPGAs), ball grid array(BGAs),BGA, digital signal processing chip (DSP), graphics accelerator chips and other high power electronic components in providing efficient heat transfer.Gel can be manual or automatic construction, can be used to print or dispensing.

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grease

Grease is easily from the equipment is applied to remove the radiator thermal interface materials.Thixotropy, can keep on the radiator form until complete mechanical fixation.ourgrease可用于各种设备，包括倒装芯片微处理器、塑料引脚级阵列(PPGAs), ball grid array(BGAs),microBGAAnd digital signal processing chip(DSP), graphics accelerator chip and high speed memory devices.

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Select the white paper

At the bottom of the flip chip filling adhesive technology

Flip chip packages have advantages than bond line design, integrated circuit (ICOne of the fastest growing segment) packaging industry.This paper introduced the development technology in filling glue at the bottom of the main challenges.In particular, low viscosity, small particle packing, fast flow and high reliability of anhydride system design and development.

Lead-free packaging technology
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